The Indian Institute of Technology Guwahati (IIT Guwahati) has signed a Memorandum of Understanding (MoU) with Tata Electronics Private Limited to set up a Centre of Excellence (CoE) on its campus for semiconductor Assembly, Testing, Marking and Packaging (ATMP). The partnership will bring new diploma-level and BTech-level programmes in semiconductor packaging, along with hands-on training, faculty development and collaborative research, with a clear focus on building a skilled talent pool in Assam and the Northeast.
The MoU was signed on 30 October 2026 at the IIT Guwahati campus by Prof. Rohit Sinha, Dean, Research and Development, IIT Guwahati, and Ranjan Bandyopadhyay, Chief Human Resources Officer, Tata Electronics. IIT Guwahati Director Prof. Devendra Jalihal and Dean, Administration, Prof. Sukumar Nandi were present, along with Vaswati Sarma Borthakur of Tata Electronics, Erwin Estepa and J M Nowful.
From classroom to chip packaging line
Under the agreement, IIT Guwahati will lead the design and delivery of the education programmes, while course content, learning resources and specialised training modules will be built jointly with Tata Electronics. The curriculum will combine classroom instruction with practical exposure to ATMP, the back-end stage of semiconductor manufacturing in which fabricated chips are assembled, packaged, tested and marked before they reach electronics makers.
The proposed Centre of Excellence will act as the hub for these academic and research activities. Beyond the programmes themselves, the collaboration covers:
- Identifying engineering colleges, universities and polytechnics that can join the initiative and widen access to semiconductor-focused education.
- Hands-on training for students from partner engineering colleges, polytechnics and other institutions.
- Joint development of industry-relevant course content and specialised training programmes.
- Training faculty from participating institutions to strengthen semiconductor teaching capacity.
- Training opportunities for students at Tata Electronics.
- Collaborative research for undergraduate and postgraduate students in semiconductor packaging, assembly, testing and related technologies.
A regional talent pipeline
“This initiative aims to connect academic institutions, industry and students through specialised education, practical training and collaborative research. By identifying relevant institutions across Assam and supporting the development of semiconductor-focused curricula, the collaboration will broaden access to specialised technical education and strengthen the regional talent pipeline,” said Prof. Devendra Jalihal, Director, IIT Guwahati.
The partnership is significant for higher and technical education in the region. As India scales up its semiconductor ambitions, the demand for packaging and testing engineers, technicians and researchers is set to grow sharply. By pulling polytechnics and state engineering colleges into a single industry-linked framework, and by training their faculty, the IIT Guwahati–Tata Electronics model could help institutions in Assam and the Northeast offer job-ready semiconductor skills rather than leaving students to seek such training elsewhere.
For learners, the combination of diploma and degree pathways, industry-designed modules and direct training opportunities at Tata Electronics offers a practical route into one of the country’s fastest-growing technology sectors.






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